PROCESS PATH
Process path
From SMT and THT to harness and box-build, with test embedded in the path. Key parameters and floor photos below.
Organized by process path: SMT, THT, cable/harness, box-build and test. Facts that help decisions — not a brochure dump.
From SMT and THT to harness and box-build, with test embedded in the path. Key parameters and floor photos below.
Print → high-speed placement → reflow → AOI / X-Ray. RoHS or leaded; clean or no-clean.
Forming, insertion, wave solder, DI wash when needed, hand solder and WIP inspection.
Crimp, solder and IDC for industrial, automotive and aircraft harness work.
Electro-mechanical assembly with ICT/FCT, burn-in, environmental test and custom packaging.
Hot-bar (FPC to rigid), automated conformal coating, laser marking, temperature cycle (-70°C to +200°C) and burn-in (to +150°C) are configured by project — not empty menu pages.